On May 14, Goermicro signed a Memorandum of Understanding (MOU) with Infineon Technologies AG at Goermicro’s Qingdao headquarters to jointly launch two new 3D ToF depth cameras — DS62 and DS95.
These products are designed for a wide range of industrial automation applications, including automated guided vehicles (AGVs), autonomous mobile robots (AMRs), item picking, automated palletizing and depalletizing, and people counting.
Goermicro’s newly introduced 3D ToF depth cameras are built on Time-of-Flight (ToF) technology and enhanced by Goermicro’s extensive R&D expertise. They offer long-range depth sensing and robust outdoor/strong-light performance, achieving an effective balance between high frame rates and cost efficiency.
The first model to launch, DS62, features a compact design measuring only 80 × 69 × 25 mm, ultra-low power consumption (<5 W), and supports “eye-in-hand” robotic arm integration — making it ideal for confined spaces or mobile platforms. The upcoming DS95 incorporates four laser projectors and a 67° × 55° field of view, providing higher thermal tolerance for demanding environments.
Both 3D depth cameras incorporate Infineon’s IRS2976C ToF image sensor, CMOS technology, and multi-frequency HDR depth imaging. The IRS2976C significantly boosts pixel quantum efficiency to over 30%, supports VGA 640 × 480 system resolution, and uses a specialized ToF CMOS process to ensure exceptional sensitivity and robustness in outdoor conditions. Together with Goermicro’s complete hardware–software solution, the cameras deliver outstanding anti-interference performance in strong-light industrial scenarios.
Compared with structured-light cameras and LiDAR, Goermicro’s 3D ToF cameras offer stronger cost advantages. Goermicro also provides comprehensive development support, including cross-platform SDKs (Windows / Linux / ROS), multi-language APIs (C / C++ / Python / C#), and integration with third-party toolchains — lowering the technical barriers for developers.
Both DS62 and DS95 deliver high precision, wide FOV, strong ambient-light resistance, high frame rates, and RGB-D fusion, offering millimeter-level measurement accuracy for advanced industrial applications.
Goermicro Chairman and CEO Song Qinglin stated:
“Our industrial applications team has remained deeply focused on industrial automation. As we continue to advance 3D ToF technology, we look forward to working closely with Infineon to drive deeper technological innovation and global market expansion, delivering higher-value solutions to industrial customers.”
Andreas Kopetz, Vice President of Infineon’s Power & Sensor Systems Division, commented:
“Infineon’s ToF image sensor portfolio is built on world-class 3D sensing technology and provides strong support for Goermicro’s new 3D ToF camera lineup. Facing numerous industry challenges, Infineon will continue deep collaboration with Goermicro to jointly unlock greater application value for 3D ToF in industrial intelligence.”
